5G Premium Smart Module SC171
The Fibocom SC171 module, powered by the robust Qualcomm QCM6490 chipset, represents a significant leap forward in 5G connectivity solutions specifically designed for the AIoT sector. This module is equipped with a sophisticated Octa-core processor and an advanced graphics engine that support 4K video displays and efficiently manage multiple camera inputs, making it perfectly suited for applications that demand intensive multimedia processing and multi-thread operations.
Leveraging the capabilities of the Qualcomm QCM6490 platform, the SC171 module supports dynamic 5G functionalities, including both NSA (Non-Standalone) and SA (Standalone) architectures. This ensures wide compatibility and future-proofs the module for evolving global network technologies. Additionally, the SC171 module's backward compatibility with 4G and 3G networks enhances its versatility across various geographic and network environments.
The SC171 module's high-performance multi-constellation GNSS receiver, made possible by the Qualcomm QCM6490, significantly enhances location services. This feature makes the module highly suitable for complex navigation and tracking applications that are critical in sectors such as logistics and automotive. Furthermore, the inclusion of dual-band Wi-Fi, Bluetooth technology, and Wi-Fi 6 compatibility highlights the module's ability to handle high-throughput, low-latency applications.
The SC171 module is designed with flexibility in mind, featuring a variety of interfaces such as MIPI, USB, UART, SPI, and I2C. This design allows seamless integration into diverse IoT ecosystems, making the SC171 exceptionally well-suited for a broad range of AIoT applications. These applications include industrial handheld devices, security systems, body-worn cameras, mobile DVRs, and even robotics.
The Qualcomm QCM6490's integration in the SC171 module ensures robust processing power of up to 12 TOPS (Tera Operations Per Second). This positions the SC171 as a pivotal element in powering next-generation smart devices that require intensive computational capabilities and advanced connectivity features. The Qualcomm QCM6490's AI engine and advanced multimedia suite enable the SC171 to deliver a new level of intelligence and interactivity for AIoT devices.
The SC171's compact form factor, combined with the powerful Qualcomm QCM6490 chipset, allows for the development of more compact and power-efficient AIoT devices. This is particularly beneficial for applications where size and power consumption are critical factors, such as in wearables and portable devices.
In addition to its powerful processing capabilities, the Qualcomm QCM6490 in the SC171 module also provides advanced security features. These include hardware-based security and secure boot capabilities, ensuring that AIoT devices using the SC171 module are protected against various security threats.
For developers and manufacturers looking to create innovative AIoT solutions, the SC171 module with the Qualcomm QCM6490 chipset offers a robust and future-ready platform. The combination of powerful processing, advanced connectivity, and comprehensive software support makes the SC171 an ideal choice for a wide range of AIoT applications.
In summary, the Fibocom SC171 module, enhanced by the Qualcomm QCM6490 chipset, is a powerful and versatile solution for the AIoT sector. With its advanced processing capabilities, comprehensive connectivity features, and robust security, the SC171 is well-positioned to enable the development of next-generation AIoT devices that are smarter, more connected, and more secure. The Qualcomm QCM6490's integration in the SC171 module is a testament to Fibocom's commitment to providing advanced and reliable connectivity solutions for the ever-evolving AIoT landscape.
